The Defense Advanced Research Projects Agency (DARPA) will award a contract next summer to establish a U.S. hub for advanced microelectronics manufacturing.
The program, called Next-Generation Microelectronics Manufacturing, will fund the research and equipment to create a domestic center for prototyping cutting-edge fabrication techniques. The agency hopes that the facility will give the U.S. semiconductor industrial base a leading edge. The goal is to stand up the capability by 2029.
The program is designed to establish a state-of-the-art, domestic capability for research, development, and production of 3DHI microelectronics at an existing location. This centralized 3DHI accelerator will focus specifically on advancing groundbreaking research, development, and collaboration, and will include an accessible pilot line for prototyping and early production of emerging microelectronics.
“Rapidly shifting geopolitics and the COVID-19 pandemic have highlighted the need for stronger domestic supply chains – including U.S. microelectronics R&D, fabrication, packaging, and assembly,” said Dr. Dev Palmer, NGMM managing director at DARPA. “Our goal is to strengthen long-term national security through trailblazing work in 3DHI that’s critical to technological superiority and sustains the U.S. competitive advantage.”
DARPA has issued a call for prospective partners to join NGMM’s upcoming Proposers Day, scheduled for Nov. 28. The Proposers Day will convene members of industry, academia, and government to promote program goals, collaboration, and the exchange of ideas and contributions.
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